The EVG320 Automated Single Wafer Cleaning System handles wafers and substrates automatically between the process stations. The robot handling system ensures pre-alignment and loading of the wafers automatically in a cassette-to-cassette or FOUP-to-FOUP operation. Besides Di-water rinse, configuration options include megasonic, brush and diluted chemicals cleaning.
- Up to four cleaning stations
- Fully-automated cassette-to-cassette or FOUP-to-FOUP handling
- Edge handling for double-sided cleaning processes available (option)
- High efficiency cleaning using 1 MHz megasonic nozzles or area transducers (option)
- Advanced remote diagnostics
- Prevents cross-contamination from back to front side
- Fully software controlled cleaning process