With the invention of the world’s first double sided alignment system in
1985, EV Group has revolutionized MEMS technology and set worldwide
industry standards in aligned wafer bonding by separating the alignment and
bonding process. This process separation results in higher flexibility and
universal application of the wafer bonding equipment. The EVG bond
alignment systems offer highest precision, flexibility, ease of use and
modular upgrade capability and have been qualified in numerous high
throughput production environments. The precision of EVG bond aligners
accommodates most demanding alignment processes in MEMS production and in
emerging fields like 3D integration applications.