Press Center

08.07.2019

EV Group Earns Exceptional Seventh Consecutive Triple Crown Win in VLSIresearch 2019 Customer Satisfaction Survey

Read more
02.07.2019

EV Group Revolutionizes Lithography with New Maskless Exposure Technology

Read more
24.06.2019

EV Group Invests 30 Million Euros for Capacity Expansion at Corporate Headquarters in Austria

Read more
11.06.2019

EV Group Brings Nanoimprint Lithography to Full-Scale Production with the First Fully Integrated 300-mm Nanoimprint Lithography Track System

Read more
21.05.2019

EV Group Wafer Bonding Solutions for Heterogeneous Integration and Wafer-Level Packaging to be Highlighted at ECTC 2019

Read more
19.03.2019

EV Group Partners with NSI to Enable First Wafer-Level Heterogeneous Integration of GaAs on Silicon for RF Front-End Module Manufacturing

Read more
13.03.2019

EV Group and Panasonic Team Up on Resist Processing Solution for Plasma Dicing

Read more
02.12.2018

EV Group Unveils Next-Generation Fusion Wafer Bonder for “More Moore” Scaling and Front-End Processing

Read more
11.11.2018

IHP – Innovations for High Performance Microelectronics Cooperates with EV Group on Low-Temperature Covalent Wafer Bonding Technologies for Developing Next-Gen Communication Devices

Read more
11.11.2018

EV Group partners with Plessey to drive GaN-on-Silicon monolithic microLED technology for AR applications

Read more
03.07.2018

EV Group Accelerates 3D-IC Packaging Roadmap With Breakthrough Wafer Bonding Technology

Read more
19.06.2018

EV Group Earns Sixth Consecutive Triple Crown Win in VLSIresearch 2018 Customer Satisfaction Survey

Read more
15.05.2018

EV Group Secures Lithography Order from VTT Technical Research Centre for More Than Moore Applications

Read more
01.05.2018

EV Group Begins Construction of New Manufacturing III Building to Expand Production Capacity

Read more
25.04.2018

WaveOptics collaborates with EV Group to drive augmented reality (AR) manufacturing at scale

Read more
02.04.2018

Converts One-third of the Sunlight into Electricity: 33.3 Percent Silicon-based Multi-junction Solar Cell

Read more
13.03.2018

EV Group and IBM Sign License Agreement on Laser Debonding Technology

Read more
19.12.2017

EV Group Completes Latest Phase of Production Capacity Expansion at Corporate Headquarters

Read more
12.12.2017

EV Group Installs Low-Temperature Plasma Activation System for Compound Semiconductor Research at the University of Tokyo

Read more
12.11.2017

Leti Demonstrates World's First 300-mm Wafer-to-Wafer Direct Hybrid Bonding With 1-Micron Pitch On EV Group System

Read more
08.10.2017

EV Group and SwissLitho to Develop Joint Nanoimprint Lithography Solution for 3D Optical Structures With Single-Nanometer Accuracy

Read more
10.09.2017

EV Group Receives Multiple Lithography and Metrology System Orders for Wafer-level Optics Manufacturing

Read more
05.07.2017

EV Group Unveils Breakthrough Low-Temperature Laser Debonding Solution for Fan-out Wafer-Level Packaging

Read more
31.05.2017

EV Group Expands Production Capacity at Corporate Headquarters in Austria

Read more
03.04.2017

EV Group Honored As Most Innovative Company in Austria

Read more
08.03.2017

EV Group Breaks Speed and Accuracy Barrier in Mask Alignment Lithography for Semiconductor Advanced Packaging

Read more
19.01.2017

Imec and EVG demonstrate for the first time 1.8µm pitch overlay accuracy for wafer bonding

Read more
26.09.2016

EV Group Extends Volume Manufacturing Expertise to Biotechnology and Medical Device Applications

Read more
11.07.2016

EV Group Rolls Out Automated Metrology System for Advanced Packaging, MEMS and Photonics Manufacturing

Read more
06.07.2016

EV Group Expands High-Vacuum Wafer Bonding Capabilities of EVG ComBond Platform for High-Volume MEMS Manufacturing

Read more

EV Group - Press contact

DI Erich Thallner Strasse 1
4782 St. Florian am Inn
Austria