뉴스

EV Group Completes Latest Phase of Production Capacity Expansion at Corporate Headquarters  

2017_12_Testrooms_1_ThumbnailST. FLORIAN, Austria, December 19, 2017-EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has completed construction and opened a new building at its corporate headquarters in Austria to expand capacity for producing its industry-leading process equipment. The building, part of an investment of more than 20 million Euros that was announced earlier this year, allows for a significant expansion of warehouse space and provides more than 50 percent additional test room space for the final assembly of EVG's high-precision systems, as well as technical source inspection of the systems by its customers.

더보기...
 

EV Group Installs Low-Temperature Plasma Activation System for Compound Semiconductor Research at the University of Tokyo  

2017_12_UniTokyo_thumbnailST. FLORIAN, Austria, December 12, 2017-EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it has received an order from the University of Tokyo for its EVG810LT plasma activation system for compound semiconductor research. Installed at the university's Takagi & Takenaka Laboratory, the EVG810LT augments the laboratory's research focused on developing novel MOSFET and electronic-photonic integrated circuits (EPICs) using III-V-on-insulator (III-V-OI) and germanium-on-insulator (GeOI) substrates.

더보기...
 

Leti Demonstrates World's First 300-mm Wafer-to-Wafer Direct Hybrid Bonding With 1-Micron Pitch On EV Group System  

2017_11_Leti_Pitch_ThumbnailST. FLORIAN, Austria and GRENOBLE, France, November 13, 2017 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, and Leti, an institute of CEA Tech, today announced the world's first successful 300-mm wafer-to-wafer direct hybrid bonding with pitch dimension connections as small as 1µm (micron). This breakthrough also achieved copper pads as small as 500nm.

더보기...
 

EV Group and SwissLitho to Develop Joint Nanoimprint Lithography Solution for 3D Optical Structures With Single-Nanometer Accuracy  

2017_10_SwissLitoCollage_thumbnailST. FLORIAN, Austria and ZURICH, Switzerland, October 9, 2017-EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, and SwissLitho AG, a manufacturer of novel nanolithography tools, today announced a joint solution to enable the production of 3D structures down to the single-nanometer scale. Initially demonstrated within the "Single Nanometer Manufacturing for Beyond CMOS Devices (SNM)" project funded by the Seventh Framework Program of the European Union, the joint solution involves SwissLitho's novel NanoFrazor thermal scanning probe lithography system to produce master templates with 3D structures for nanoimprint lithography (NIL), and EVG's HERCULES® NIL system with SmartNIL® technology to replicate those structures at high throughput.

더보기...