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EV Group Partners with NSI to Enable First Wafer-Level Heterogeneous Integration of GaAs on Silicon for RF Front-End Module Manufacturing  

2019_03_NSI_thumbnailSEMICON CHINA, March 20, 2019-EV Group (EVG) today announced that it has partnered with Ningbo Semiconductor International Corporation (NSI), a specialty semiconductor foundry based in Ningbo, China, in the development of the industry's first process technology platform for wafer-level heterogeneous integration of gallium arsenide (GaAs) on silicon for use in RF front-end module (FEM) manufacturing. This marks an important milestone in the development of next-generation, high-performance, ultra-compact RF front-end chipsets that are needed for 4G and 5G smartphones and other handsets.

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EV GROUP AND PANASONIC TEAM UP ON RESIST PROCESSING SOLUTION FOR PLASMA DICING  

2019_03_Panasonic_figure1_thumbnailSt. Florian, Austria / Osaka, Japan, March 13, 2019 -- EV Group (EVG) and Panasonic Smart Factory Solutions Co., Ltd. announced today that both companies have teamed up to provide a novel resist processing solution for plasma dicing that is developed for emerging applications, such as Internet of Things (IoT) sensors, MEMS, RFID, CMOS image sensors and thinned memories. This advanced solution, which incorporates the EVG®100 series of resist processing systems and Panasonic's APX300 Dicer Module plasma dicer, became available from March 13, 2019.

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EU project CALADAN set to reduce manufacturing cost of Terabit/s capable optical transceivers  

2019_03_Caladan_thumbnailEU project CALADAN set to reduce manufacturing cost of Terabit/s capable optical transceivers. CALADAN is an EU H2020 project, coordinated by IDLab, an imec research group at the Ghent University, which will establish a supply chain for fabrication of optical transceivers at significantly lower cost and higher throughput than what is achievable using current fabrication methods.

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EV 그룹, 무어의 법칙 이상의, 미세화와 전공정을 위한차세대 퓨전 웨이퍼 본딩 장비 출시  

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2019 1 22 MEMS , 나노 기술 , 반도체 제조용 웨이퍼 본딩 리소그래피 장비 분야의 선도적인 공급 업체인 EV 그룹 ( 이하 EVG) 완전히 새로워진 자동화 생산 퓨전 본딩 시스템인 BONDSCALE™ 출시한다고 밝혔다 . BONDSCALE 모놀리식 3D(M3D) 같은 레이어 전이 공정 기술을 활용하는 첨단 공업용 기판 제조 3D 통합 방식 광범위한 퓨전 / 분자 웨이퍼 본딩 애플리케이션에 활용될 있도록 설계됐다 . 이번 BONDSCALE 출시를 통해 , EVG 웨이퍼 본딩 기술을 프런트엔드 반도체 처리 공정에 제공함으로써 , IRDS(International Roadmap for Devices and Systems) 무어의 법칙 이상으로 로직 디바이스를 향상시키고자 때의 과제들로 오래 전부터 확인해 문제들을 해결하는 기여했다 . 더욱 강화된 엣지 정렬 기술을 채용함으로써 , BONDSCALE 기존 퓨전 본딩 플랫폼에 비해 웨이퍼 본딩 생산성이 크게 향상됐으며 , 소유 비용 (CoO) 크게 낮아졌다 . 고객에 대한 장비 선적은 이미 시작됐다 .


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