Hot Embossing Systems

EV Group’s series of high-precision hot embossing systems are based on the company’s market-leading wafer bonding technology. Excellent pressure and temperature control as well as uniformity over large areas allow for high accuracy imprints. Hot embossing is a cost-effective and flexible fabrication technology with very high replication accuracy for feature sizes down to 50 nm. The systems are well suited for embossing complex micro- and nanostructures and high-aspect ratio features into a wide range of polymer substrates or spin-on-polymers. The combination with stamp-to-substrate alignment allows alignment of hot embossing to pre-processed substrate structures.  

Choose your Hot Embossing System


EVG®510 HE

Hot Embossing System

Highly flexible hot embossing system for R&D and small volume production.


EVG®520 HE

Hot Embossing System

A universal production-proven hot embossing system meeting highest demands.

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