The EVG® IQ Aligner® platform is optimized for automated contactless proximity processing for wafer sizes up to 200 mm.
The IQ Aligner is a contactless proximity lithography platform with a high grade of automation that fulfills the demand for minimizing mask contamination in production lines and increasing mask lifetime and product yield. In addition to multiple alignment features, the system is widely installed and field proven with specialized configurations for automated handling and processing of warped or thinned wafers. Mix-and-match operation between standard top- or bottom-side alignment with integrated IR alignment capabilities further widen the field of applications, especially on alignment with engineered or bonded substrates. The system also supports wafer alignment runout control with fast-response, temperature-controlled tool sets.
Features
- Wafer/substrate size from pieces up to 200 mm/8’’
- Contactless proximity mode due to external wafer wedge measurement
- Enhanced vibration isolation
- Increased process flexibility with various alignment features
- Run-out control alignment feature
- Fragile, thin or warped wafer handling of multiple wafer sizes
- Taiko wafer processing experience
- Manual substrate loading capability
- Remote tech support and SECS/GEM compatibility
- Additional capabilities:
- IR alignment – transmissive and/or reflective
Technical Data
| Wedge compensation |
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| Fully automatic - SW controlled |
| Contactless |
| Advanced alignment features |
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| Automatic alignment |
| Large gap alignment |
| Run-out control alignment |
| Dynamic alignment |
| Industrial automation features |
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| Cassette / SMIF / FOUP / SECS/GEM / thin, bowed, warped, edge wafer handling |
| Wafer diameter (substrate size) |
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| Up to 200 mm |
| Alignment modes |
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| Top side alignment: ≤ ± 0,5 µm |
| Bottom side alignment: ≤ ± 1,0 µm |
| IR alignment: ≤ ± 2,0 µm/ substrate material depending |
| Exposure setup |
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| Vacuum contact / hard contact / soft contact / proximity mode / flex mode |
| Exposure options |
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| Interval exposure / flood exposure |
| System control |
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| Operations system: Windows |
| File sharing & back-up solution / unlimited no. recipes & parameters |
| Multi-language user GUI & support: CN, DE, FR, IT, JP, KR |
| Real-time remote access, diagnostics & troubleshooting |
| Throughput |
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| Fully-automated: throughput first print: 85 wafers per hour |
| Fully-automated: throughput aligned: 80 wafers per hour |
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