EVG®850 TB

Automated Temporary Bonding System

Fully automated temporary wafer bonding of a substrate on a rigid carrier

The fully automated temporary bonding system achieves the whole temporary bonding process – starting with temporary adhesive application, baking, alignment and bonding of the device wafer to the carrier wafer – within one automated tool. The equipment layout is modular as with all of EVG’s fully automated tools, meaning it can be throughput-optimized depending on the specific process. The optional inline metrology module allows total process monitoring and parameter optimization with feedback loops.
Because of EVG’s open platform, different types of temporary bonding adhesives can be used, such as spin coat thermoplast, thermoset materials, or tapes.

Features

  • Open adhesive platform
  • Various carriers (silicon, glass, sapphire, etc…)
  • Bridge tool capability for different substrate sizes
  • Available with multiple load port options and combinations
  • Recipe controlled system
  • Real time monitoring and recording of all relevant process parameters
  • Fully integrated SECS/GEM interface
  • Optional integrated inline metrology module for automated feedback loop
EVG850 TB

Technical Data

Wafer diameter (substrate size)
Up to 300 mm, oversized carrier possible
Different substrate / carrier combinations
Configuration
Coat module
Bake module with multiple hot plates
Align module with optical or mechanical alignment
Bond module
Options
Inline Metrology
ID reading
High topography wafer handling
Warped wafer handling

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