Within the fully automated debonder, the processed temporary bonding wafer stack is separated and cleaned, with the fragile device wafer always supported throughout the whole tool. Supported debonding methods include UV laser, thermal and mechanical debonding. With all debonding methods, the device wafer is either supported through film frame mounting or through a thin wafer handler.
Reliable handling of thinned, bowed and warped wafers with and without topography
Automated cleaning of debonded wafer
Recipe controlled system
Real time monitoring and recording of all relevant process parameters
Fully integrated SECS/GEM interface in automated tools
Bridge tool capability for different substrate sizes
Modular tool layout → throughput-optimized depending on specific process