EVG®101

Advanced Resist Processing System

Single-wafer resist processing in R&D and small-scale production

The EVG101 resist processing system performs R&D-type processes on a single chamber design, which is fully compatible with EVG’s automated systems. The EVG101 supports wafers up to 300 mm and can be configured for spin or spray coating and developing. Conformal layers of photoresist or polymers are achieved on 3D structured wafers for interconnection techniques with EVG’s advanced OmniSpray coating technology. This ensures low material consumption of precious high-viscosity photoresists or polymers while improving uniformity and resist spreading options.

Features

  • Wafer size up to 300 mm
  • Automated spin or spray coating or developing with manual wafer load/unload
  • Quick and easy process transfer from research to production utilizing proven modular design and standardized software
  • Syringe dispense system for utilization of small resist volumes, including high-viscosity resists
  • Small footprint while maintaining a high level of personal and process safety
  • Multi-user concept (unlimited number of user accounts and recipes, assignable access rights, different user interface languages)
  • Options:
    • Uniform coating of high-topography wafer surfaces with OmniSpray® coating technology
    • Wax and epoxy coating for subsequent bonding processes
    • Spin-On-Glass (SOG) coating
EVG101

Technical Data

Available modules
Spin coat / OmniSpray® / develop
Dispense options
Various resist despense pumps to cover a wide range of viscosities up to 52000 cP
Liquid priming / pre-wet / bowl wash
Edge bead removal (EBR) / back-side rinse (BSR)
Constant pressure dispense systems / syringe dispense system
Smart process control & data analysis features (framework SW platform)
Integrated analysis features for process and machine control
Parallel task / queueing task processing feature
Equipment and process performance tracking feature
Smart handling features
Occurences & alarms analysis / smart maintenance management & tracking
Wafer diameter (substrate size in mm)
Up to 300
Spin coat module - spinner parameter (rpm)
Spin speed: up to 10 k
Acceleration speed: up to 10 k
Spray coat module - spray generation
Ultrasonic atomization nozzle / high-viscosity nozzle
Develop module - dispense options
Puddle development / spray development
Additional module options
Pre-alignment: mechanical
System control
Operations system: Windows
File sharing & back-up solution / unlimited no. recipes & parameters / offline recipe editor
Flexible process flow definition / easy drag and drop recipe programming
Parallel processing of multiple jobs / real-time remote access, diagnostics & troubleshooting
Multi-language user GUI & support: CN, DE, FR, IT, JP, KR

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