EVG®610

Semi-automated Mask Alignment System

The EVG®610 is a compact and multi-purpose R&D system that can handle small substrate pieces and wafers up to 200 mm.

The EVG610 supports a variety of standard lithography processes, such as vacuum-, hard-, soft-, and proximity exposure modes, with the option of back-side alignment. Moreover the system offers additional capabilities including bond alignment and nanoimprint lithography (NIL). The EVG610 offers quick processing and re-tooling for changing user requirements with a conversion time of less than a few minutes. Its advanced multi-user concept can be adapted from beginners to expert level, thus making it ideal for universities and R&D applications. 

Features

  • Wafer/substrate size from pieces up to 200 mm/8’’
  • Top-side and bottom-side alignment capability
  • High-precision alignment stage
  • Automated wedge compensation sequence
  • Motorized and recipe-controlled exposure gap
  • Supports the latest UV-LED technology
  • Minimized system footprint and facility requirements
  • Step-by-step process guidance
  • Remote tech support
  • Multi-user concept (unlimited number of user accounts and recipes, assignable access rights, different user interface languages)
  • Agile processing and conversion re-tooling
  • Table top or stand-alone version with anti-vibration granite table
  • Additional capabilities:
    • Bond alignment
    • IR alignment
    • Nanoimprint lithography (NIL)
EVG610

Technical Data

Alignment modes
Top side alignment: ≤ ± 0,5 µm
Bottom side aligment: ≤ ± 2,0 µm
IR alignment: ≤ ± 2,0 µm/ substrate material depending
Bond alignment: ≤ ± 2,0 µm
NIL alignment: ≤ ± 2,0 µm
Exposure source
Mercury light source / UV LED light source
Wedge compensation
Fully automatic - SW controlled
Wafer diameter (substrate size in mm)
Up to 100 / 150 / 200
Exposure setup
Vacuum contact / hard contact / soft contact / proximity mode
Exposure options
Interval exposure / flood exposure / sector exposure
Advanced alignment features
Manual alignment / in-situ alignment verification
Manual cross correction
Large gap alignment
System control
Operation system: Windows
File sharing & back-up solution / unlimited no. recipes & parameters
Multi-language user GUI & support: CN, DE, FR, IT, JP, KR
Real-time remote access, diagnostics & troubleshooting
Nanoimprint lithography technology
UV-NIL

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