The EVG520 HE Semi-automated Hot Embossing System is designed for high-precision imprinting of thermoplastic substrates. This production-proven system from EVG accepts substrates up to 200 mm in diameter, and is compatible with standard semiconductor manufacturing technologies. The hot embossing system is configured with a universal embossing chamber as well as high-vacuum and high-contact force capabilities, and manages the whole range of polymers suitable for hot embossing. Together with high-aspect-ratio embossing and multiple de-embossing options, many processes for high-quality pattern transfer and nanometer resolution are offered.
For hot embossing and nanoimprinting applications of polymer substrates and spin-on polymers
Automated embossing process
EVG's proprietary separate alignment process for optically aligned embossing and imprinting