Wafer Level Optics

Aligned UV Bonding
The final micro optics stack is fabricated by UV bonding of all elements, including individual double-side microlens wafers as well as spacer wafers to achieve the final stack height. Crucial parameters are lens-to-spacer alignment accuracy, total thickness variation of the resulting bond interface and wafer throughput.

Individual process steps featured by EV Group:

  • Wedge compensated, aligned UV bond
  • UV exposure


Please see our related product IQ Aligner® and our GEMINI® integrated bonding systems for detailed information.


UV bonded micro optics stack consisting of lens wafers and spacer wafers. Source EVG.

Individual lens and spacer wafers of a micro optics stack prior to UV bonding. Courtesy of Aptina.