Solutions for R&D

As a technology and market leader in wafer processing solutions for semiconductor, MEMS and nanotechnology applications, EVG supports partners and customers to make their ideas a reality.

Wafer processing services on any EVG equipment including special processes such as 

  • Plasma activated direct bonding
  • ComBond® - conductive bonding of Si and compound semiconductors
  • High vacuum aligned bonding
  • Temporary bonding and thermal, mechanical or laser debonding
  • UV-NIL on large substrates
  • Lens molding
  • Master stamp and working stamp fabrication for SmartNIL®

 

Customer tailored evaluation programs

  • NIL stamps and materials
  • Bonding processes
  • Bonding adhesives
  • Resist processing
  • Debonding processes

 

Please see our dedicated process technology page for more information.

 

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Cleanroom at EVG Headquarters

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Panel-size substrate imprinting utilizing SmartNIL® technology in EVG's application lab