Solutions for R&D

As a technology and market leader in wafer processing solutions for semiconductor, MEMS and nanotechnology applications, EVG supports partners and customers to make their ideas a reality.

As a technology and market leader in wafer processing solutions for semiconductor, MEMS and nanotechnology applications, EVG supports partners and customers to make their ideas a reality.

EVG’s track record of innovations in the field of micro- and nano-fabrication technologies is unique. We realize our vision of being the first in exploring new techniques and serving next-generation applications of micro- and nano-fabrication technologies through intensive R&D collaborations.
On average, EVG participates in more than 10 European cooperative R&D projects and cooperates on several joint development programs with R&D institutes worldwide every year.

EV Group has been working with research facilities for more than 35 years, giving us insight into their unique requirements. Our dedicated R&D tools provide superior technology combined with maximum flexibility, enabling universities, research institutions and technology development partners to scale processes across multiple research projects and applications. What’s more, the R&D equipment integrates seamlessly with EVG’s core technology platforms, which span the entire manufacturing chain from R&D all the way to small-scale and high-volume production. Full software and recipe compatibility between R&D and full-scale production systems enables researchers to migrate their processes to volume-production environments.

Benefits

Multi-purpose Equipment:

  • EVG®620 / EVG®6200, EVG®610:
    Lithography, Nanoimprinting, Bond alignment
  • EVG®520, EVG®510:
    Bonding, Hot embossing
  • EVG®101:
    Spin coating, Spray coating

Multiple Process Capabilities:

  • Nanoimprint Lithography (NIL):
    SmartNIL®, Hard UV-NIL, Soft UV-NIL, Micro contact printing, Lens molding
  • Bonding:
    Metal (transient liquid phase, eutectic, thermo-compression), Glass frit, Anodic, Adhesive, Temporary adhesive
  • Coating:
    Spin coating, OmniSpray®, Conformal coatings of topography, Uniform thick resist coatings for high topography, Adhesive coating for bonding

Process Services:

  • Access to industrial equipment and processes
  • Customer-tailored evaluation programs
  • Very small batches possible
  • High success rate for sample processing
  • Access to EVG’s service providers

R&D Cooperation:

  • Application and market expertise
  • Industrial partner network
  • Consulting and proof of concepts
  • Upscaling processes
  • Implementation of engineering concepts and solutions in equipment and tooling
  • Industrial qualification of processes and equipment

 

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Click to enlarge the multi-porpose equipment infographic