Logic / Memory

A variety of memory and logic devices, including DRAM (dynamic random access memory), SDRAM (synchronous dynamic random access memory), Flash memory (NAND or NOR), CPU (central processing unit), GPU (graphics processing unit), etc., are widely used in computers, digital music players, gaming devices and mobile internet devices. For instance, since SDRAM was introduced to computers, further generations of SDRAM (DDR1, DDR2 and DDR3) have entered the mass market, with DDR4 currently being designed and anticipated to become available in the coming years.

Thin wafer handling is a very versatile technology used in various semiconductor manufacturing processes such as 3D IC stacking and the production of CMOS image sensors, MEMS, LED and power devices. Thin wafer handling capabilities generally enable the handling wafers during backside grinding, where the substrate is thinned down to the single digit micrometer scale, as well as the subsequent backside processing, without any damages to the wafer. EV Group supports two different approaches to accomplish it. The first approach is enabled by dedicated direct handling technologies, e.g., thin wafer robot end-effectors. The second approach is based on temporary bonding and debonding technology.

The thick and rigid device wafer is bonded onto a carrier substrate before the thinning step is performed. Now the setup is similar to a SEMI standard wafer and the backside of the device wafer can be processed. Afterwards the thin device wafer is debonded from the carrier wafer and unloaded to the desired output format. (e.g., film frame). This approach offers the tremendous advantage that thinned wafers can be processed in tools designed for wafers which have the SEMI standard thickness, thereby saving the costs for reconfiguration of these tools and guaranteeing highest flexibility for the customer.

Please see our related products EVG®850TB and EVG®850DB for detailed information.