Mask Alignment Systems

EV Group´s inventions such as the world's first double-sided alignment system in 1985 have pioneered and set the industry standards in double-side lithography and aligned wafer bonding.

EV Group maintains the lead in these areas by the continuous introduction of new mask aligner generations providing the most advanced lithography technology. Accommodating wafers and substrates up to 300mm, varying in size, shape and thickness, the EV Group´s mask alignment systems target MEMS, wafer bumping, chip scale packaging as well as all applications in compound semiconductors, power devices and photovoltaic. Automated mask alignment systems are optimized for highest throughput, highest mean time between failures and most reliable print gap settings.