EVG®101 Advanced Resist Processing System

Single wafer processing in R&D and small scale production.


The EVG101 series perform R&D type processes on a single chamber design, which is fully compatible with our automated systems. The EVG101 supports wafers up to 300 mm and can be configured for spin or spray coating and developing. Conformal layers of photoresist or polymers are achieved on 3D structured wafers for interconnection techniques with EVG's advanced OmniSpray® coating technology. This ensures low material consumption of precious high-viscosity photoresists or polymers while improving uniformity and resist spreading options.


  • Automated spin or spray coating or developing with manual wafer load/unload
  • Easy process transfer from research to production utilizing proven modular design
  • Syringe dispense system for utilization of small resist volumes, including high viscosity resists
  • Small footprint while maintaining a high level of personal and process safety
  • Options:
    - Uniform coating of high topography wafer surfaces with OmniSpray® coating technology
    - Wax and Epoxy coating for subsequent bonding processes
    - Spin-On-Glass (SOG) coating