Configurable for all wafer bonding processes such as anodic, thermo
compression, fusion bonding, or LowTemp plasma bonding.
EV Group Honored As Most Innovative Company in Austria
EV Group Breaks Speed and Accuracy Barrier in Mask Alignment Lithography for Semiconductor Advanced Packaging
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MEMS Engineer Forum 2017
NIL Industrial Day 2017
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EV Group Wins Order for UV-NIL/Hot Embossing Systems from Fraunhofer ENAS
EV Group Extends Wafer Bonding Equipment and Process Solutions for Covalent Bonding Technology
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EV Group Corporate Video