EVG®810LT LowTemp™ Plasma Activation System
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Advanced Packaging, 3D Interconnect

Wafer level packaging employs specific alignment and wafer bonding techniques as an enabling solution for stacking of wafers and three-dimensional integration of devices.


Compound Semiconductor and Silicon-Based Power Devices

Microelectronic applications fabricated out of compound semiconductors as well as silicon-based power devices basically require dedicated manufacturing technologies offered by EVG.



Micro-Electro-Mechanical Systems (MEMS) is the integration of mechanical elements, sensors, actuators, and electronics on a common silicon substrate through microfabrication technology.



Nanoimprint Lithography (NIL) is one of the most promising and cost-effective new techniques for generating nanometer-scale-resolution patterns for a variety of commercial applications in BioMEMS, microfluidics, optics, patterned media and electronics.


SOI & Engineered Substrates

SOI (Silicon-on-Insulator) is a semiconductor technology, which enables a full isolation of each electronic component on an integrated circuit by using a buried oxide layer.