Micro-Electro-Mechanical Systems (MEMS) is the integration of mechanical elements, sensors, actuators, and electronics on a common silicon substrate through microfabrication technology.

80µm SU-8 resist features with sidewall angles approaching 90°.
Courtesy of DALSA Corporation.

MEMS Accelerometer.
Courtesy of ST Microelectronics. 

MEMS Gyroscope application.
Courtesy of Apple.

Sub-µm high-aspect ratio structures
created with DUV-Lithography.
Courtesy of CEETAM.

NanoSpray coating, 100µm diameter and 300µm depth. Source EVG.

8-layer direct bond cross-section. Courtesy of MIT.

MEMS Microphone.
Courtesy of Akustika.

Patterned, spray coated resist layer in anisotropically etched cavity. Courtesy of TU-Delft DIMES.

High-Q-3D solenoid industors for RF ICs. Courtesy of SIMIT.

Glass-frit bond interface.
Courtesy of ST Microelectronics.