EV Group gains Amberwave Systems as a new customer for bonding and plasma activation solutions

Significant Order Win for EVG Expands Company's Presence in LED Market

ST. FLORIAN, AUSTRIA, April 29, 2009 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it has received an order from AmberWave Systems for its EVG520IS wafer bonding system and its EVG810LT low-temperature plasma activation system.  The systems will be used to manufacture AmberWave's innovative engineered substrate products set to increase the efficiency of high-brightness light-emitting diodes (LEDs), while reducing overall cost.  This order is a significant win for EVG as it brings AmberWave on board as a strategic new customer, and further solidifies EVG's presence within the burgeoning LED market.  The tools were shipped and installed at AmberWave's Salem, New Hampshire manufacturing facility earlier this year.

AmberWave replaced competitive tools with EVG systems due to their superior performance and technical advantages.  This included a custom-designed solution comprising a custom-engineered bond head that provides high-temperature (650 degrees Celsius) and high-force (60 kN) bonding capabilities.  Other decision criteria for this order included EVG's willingness to explore novel tool configurations to meet the unique challenges associated with the target class of materials.  Specifically, the EVG systems will be instrumental to AmberWave's layer transfer of GaN materials into poly AIN.  This will allow AmberWave to manufacture more cost-effective LED-, blue laser- and GaN-based power amplifier products.

According to AmberWave Vice President, Business Development, Wade Sheen, "The decision to purchase this bonding equipment was an easy one, as it became clear early on that EVG's systems were the superior technology choice for this application.  In meeting both our current and future technology requirements, these systems will allow us to quickly ramp up our manufacturing capacity and make our products more cost-effective for our customers."

Commenting on today's announcement, Steven Dwyer, vice president and general manager, EV Group North America, noted, "AmberWave is a tremendous strategic win for us on multiple levels.  Not only are they on the cutting-edge of innovation, but AmberWave's technology is focused on some key growth segments of the semiconductor industry.  Emerging markets such as GaN-based LEDs require new, unique solutions to bring down rising manufacturing costs.  This is a great opportunity for EV Group to further expand our presence in the LED market and access new growth opportunities.

About AmberWave
Founded in 1998, AmberWave Systems has become a leader in the research, development and licensing of advanced technologies for semiconductor manufacturing.  By funding and guiding university research, AmberWave Systems is bringing new technology developments to fruition through patents and technology licensing.  In conjunction with its university research projects, AmberWave Systems conducts its own research, development and limited manufacturing in its semiconductor fabrication facility in Salem, New Hampshire.  In addition, AmberWave Systems collaborates with other technology focused companies to further expand and develop its research.  For more information about the company, please visit its Web site at www.amberwave.com.

About EV Group
EV Group (EVG) is a world leader in wafer-processing solutions for semiconductor, MEMS and nanotechnology applications.  Through close collaboration with its global customers, the company implements its flexible manufacturing model to develop reliable, high-quality, low-cost-of-ownership systems that are easily integrated into customers' fab lines.  Key products include wafer bonding, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems.

In addition to its dominant share of the market for wafer bonders, EVG holds a leading position in NIL and lithography for advanced packaging and MEMS.  Along these lines, the company co-founded the EMC-3D consortium in 2006 to create and help drive implementation of a cost-effective through-silicon via (TSV) process for major ICs and MEMS/sensors.  Other target semiconductor-related markets include silicon-on-insulator (SOI), compound semiconductor and silicon-based power-device solutions.

Founded in 1980, EVG is headquartered in St. Florian, Austria, and operates via a global customer support network, with subsidiaries in Tempe, Ariz.; Albany, N.Y.; Yokohama and Fukuoka, Japan; Seoul, Korea and Chung-Li, Taiwan.  The company's unique Triple i-approach (invent - innovate - implement) is supported by a vertical integration, allowing EVG to respond quickly to new technology developments, apply the technology to manufacturing challenges and expedite device manufacturing in high volume.  More information is available at www.EVGroup.com.

EV Group Contacts:
Clemens Schütte
Director, Marketing and Communications
EV Group
Tel: +43 7712 5311 0
E-mail: Marketing@EVGroup.com
Karen Do
Account Manager
MCA, Inc.
Tel: +1-650-968-8900, ext. 108
E-mail: kdo@mcapr.com