Listen to our talk "Hybrid Wafer-to-Wafer and Die-to-Wafer Technology for Heterogenous Integration Applications" held by Dr. Dragoi in Symposium VII: Packaging and Assembly.
Meet EVG at booth #3131 at SEMICON China 2024!
Listen to our Talk "Unlocking New Possibilities: Nanoimprint Lithography for AR/VR/XR Waveguide Fabrication" held by Senior Process Technology Engineer Schuster Patrick on March, 29 at the eXtended Reality Korea.
Visit us at our booth at the CS / PIC and PE International Conference and listen to our talks:
"Heterogenous Integration of Compound Semiconductors by W2W and D2W Bonding" held by Business Development Manager Anton Alexeev at the CS Conference.
"Advances in PIC Manufacturing for Sensing and Datacom Applications – All Thanks to Nanoimprint Lithography" held by Business Development Manager Thomas Achleitner at the PIC Conference.
"Cost-effective SiC substrate manufacturing for power devices enabled by oxide-free wafer bonding" held by Business Development Manager Bernd Dielacher at the PE Conference.
Wednesday, April 24, 2024