High Brightness LEDs
 Related Products



EVG®101 Advanced Resist Processing System

The EVG101 series perform R&D type processes on a single chamber design, which is fully compatible with our automated systems.


EVG®120 Automated Resist Processing System

The EVG120 Automated Resist Processing System is an economical tool for quality spin coating and develop processes, especially for standard photoresist applications.


EVG®620 Automated Mask Alignment System

Mask Alignment System designed for optical double-side lithography. Volume production types and manual R&D systems are available.


EVG®770 Automated NIL Stepper

EV Group's NIL Stepper is designed for step and repeat large area UV-Nanoimprint Lithography (UV-NIL) processes compatible for 100 mm up to 300 mm wafers.


HERCULES® Lithography Track System

The HERCULES® is a fully-integrated lithography track solution for wafers and substrates up to 300 mm, featuring EVG’s established optical mask alignment technology with integrated cleaning, resist coating, baking and resist development modules.


IQ Aligner® Automated UV Nanoimprint Lithography System

The IQ Aligner automated double-side UV-NIL system allows for micromolding and nanoimprinting processes with stamps and wafers from 150 mm to 300mm diameter.



EVG®560 Automated Wafer Bonding System

The EVG560 accepts up to four bond chambers with various bond chamber configuration options for all bonding processes and wafers up to 300 mm.


EVG®805 Semi-automated Debonding System

The EVG805 is a semi-automated system for debonding thin wafers from sapphire, quartz or silicon carriers.


EVG®810LT LowTemp™ Plasma Activation System

The EVG810LT LowTemp™ plasma activation system is a single chamber, stand-alone unit for SOI, MEMS, compound semiconductors and advanced substrate bonding.


EVG®850 Automated Production Bonding System for SOI

The EVG850 is designed to fulfill a wide range of fusion wafer bonding applications, with main focus on SOI substrates manufacturing. The EVG850 is the only production bonding system built to operate in high throughput, high-yield environments.


EVG®850DB Automated Debonding System

The EVG850DB Automated Debonder is designed for automated debonding of device wafer from the carrier substrate.


EVG®850TB Automated Temporary Bonding System

The EVG850 bonds compound semiconductor wafers to sapphire, quartz or silicon carriers by use of dry film, spin-on adhesives, or wax.


GEMINI® Automated Production Wafer Bonding System

EV Group's GEMINI provides a fully automated and integrated platform for wafer-to-wafer alignment and wafer bonding.