EVG®820

Lamination System

Automated, stress-free lamination of any kind of dry adhesive film (tape) onto a wafer

The EVG820 lamination station is used for automated, stress-free lamination of any kind of dry adhesive film onto the carrier wafer. This unique lamination technology performs punching of the adhesive tape supplied on a roll, followed by alignment and lamination onto the wafer. The material usually is a double-side adhesive tape. With punching technology, size and dimension of tape are freely selectable and independent from substrate.

Features

  • Automated, stress-free and void-free lamination of any kind of dry adhesive film onto the carrier wafer  
  • Precision-aligned lamination on carrier wafer
  • Protective liner peel-off
  • The dry film lamination station can be integrated into an EVG®850 TB temporary bonding system
EVG820

Technical Data

Wafer diameter (substrate size)
Up to 300 mm
Configuration
1 punch unit
Bottom side protective liner peel-off
Lamination
Options
Top side protective liner peel-off
Optical alignment
Heated lamination

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