Vertical stacking of semiconductor devices has become an increasingly viable approach to enabling continuous improvements in device density and performance. Wafer-to-wafer bonding is an essential process step to enable 3D stacked devices. EVG's GEMINI FB XT integrated fusion bonding system extends current standards and combines higher productivity with improved alignment and overlay accuracy for applications such as memory stacking, 3D systems on chip (SoC), backside illuminated CMOS image sensor stacking, and die partitioning. The system features the new SmartView NT3 bond aligner, developed specifically for fusion and hybrid wafer bonding alignment requirements of < 50 nm.
New SmartView® NT3 face-to-face bond aligner with sub 50 nm wafer-to-wafer alignment accuracy
Up to six pre-processing modules like:
LowTemp™ plasma activation module
Alignment verification module
XT Frame concept for highest throughput with EFEM (Equipment Frontend Module)