EV GroupProdukteWafer-BondingFusion and Hybrid Bonding Systems

Fusion and Hybrid Bonding Systems

Fusion or direct wafer bonding enables permanent connection via dielectric layers on each wafer surface used for engineered substrates or layer transfer applications such as backside illuminated CMOS image sensors.

Hybrid bonding extends fusion bonding with embedded metal pads in the bond interface, allowing face-to-face connection of wafers. The main application for hybrid bonding is advanced 3D device stacking.

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