The EVG bond alignment systems offer the highest precision, flexibility and ease of use, modular upgrade capability, and have been qualified in numerous high-throughput production environments. The precision of EVG bond aligners accommodates the most demanding alignment processes in MEMS production and in emerging fields like 3D integration applications.
Suitable for all EVG 200 mm bond systems
Supports bond alignment of double or triple wafer stacks up to 200 mm wafer sizes
Manual or motorized alignment stage with automatic alignment option