Highly flexible hot embossing system for R&D and small volume production
The EVG510 HE Semi-automated Hot Embossing System is designed for high-precision imprinting of thermoplastic substrates. The equipment is configured with a universal embossing chamber as well as vacuum and contact force capabilities, and manages the whole range of polymers suitable for hot embossing. Together with high-aspect-ratio embossing and multiple de-embossing options, many processes for high-quality nanopattern transfer are offered.
Features
- For hot embossing applications of polymer substrates and spin-on polymers
- Automated embossing process
- EVG's proprietary separate alignment process for optically aligned embossing and imprinting
- Fully software controlled process execution
- Closed-loop cooling water supply option
- External de-embossing and cooling station
Technical Data
| Heater size | 150 mm | 200 mm |
|---|---|---|
| Maximum substrate dimension | 150 mm | 200 mm |
| Minimum substrate dimension | single chips | 100 mm |
| Max Contact Force |
|---|
| 10, 20, 60 kN |
| Max. Temperature |
|---|
| Standard: 350 °C |
| Optional: 550 °C |
| Bond chuck system / Alignment system |
|---|
| 150 mm heater: EVG®610, EVG®620, EVG®6200 |
| 200 mm heater: EVG®6200, MBA300, SmartView® NT |
| Vacuum |
|---|
| Standard: 0.1 mbar |
| Optional: 0.00001 mbar |
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