EVG inventions such as the world's first double-sided alignment system in
1985 have pioneered and set the industry standards in double-side
lithography and aligned wafer bonding.
EV Group maintains the lead in these areas by the continuous introduction
of new mask aligner generations providing the most advanced lithography
technology. Accommodating wafers and substrates up to 300mm, varying in
size, shape and thickness, the EVG mask aligners target MEMS, wafer
bumping, chip scale packaging as well as all applications in compound
semiconductors, power devices and photovoltaic. Automated mask aligners are
optimized for highest throughput, highest mean time between failures and
most reliable print gap settings.