The EVG® IQ Aligner® platform is optimized for automated contactless proximity processing for wafer sizes up to 200 mm.
The IQ Aligner is a contactless proximity lithography platform with a high grade of automation that fulfills the demand for minimizing mask contamination in production lines and increasing mask lifetime and product yield. In addition to multiple alignment features, the system is widely installed and field proven with specialized configurations for automated handling and processing of warped or thinned wafers. Mix-and-match operation between standard top- or bottom-side alignment with integrated IR alignment capabilities further widen the field of applications, especially on alignment with engineered or bonded substrates. The system also supports wafer alignment runout control with fast-response, temperature-controlled tool sets.
Wafer/substrate size from pieces up to 200 mm/8’’
Contactless proximity mode due to external wafer wedge measurement
Enhanced vibration isolation
Increased process flexibility with various alignment features
Run-out control alignment feature
Fragile, thin or warped wafer handling of multiple wafer sizes