Automated, stress-free lamination of any kind of dry adhesive film (tape) onto a wafer
The EVG820 lamination station is used for automated, stress-free lamination of any kind of dry adhesive film onto the carrier wafer. This unique lamination technology performs punching of the adhesive tape supplied on a roll, followed by alignment and lamination onto the wafer. The material usually is a double-side adhesive tape. With punching technology, size and dimension of tape are freely selectable and independent from substrate.
Features
- Automated, stress-free and void-free lamination of any kind of dry adhesive film onto the carrier wafer
- Precision-aligned lamination on carrier wafer
- Protective liner peel-off
- The dry film lamination station can be integrated into an EVG®850 TB temporary bonding system
Technical Data
| Wafer diameter (substrate size) |
|---|
| Up to 300 mm |
| Configuration |
|---|
| 1 punch unit |
| Bottom side protective liner peel-off |
| Lamination |
| Options |
|---|
| Top side protective liner peel-off |
| Optical alignment |
| Heated lamination |