EVG®850LT Automated Production Bonding System for SOI and Direct Wafer Bonding

Designed to fulfill a wide range of fusion/molecular wafer bonding applications.

 

Wafer bonding is one key enabling technology for the SOI wafer fabrication process as well as for wafer-level 3D integration. With the EVG850LT automated production bonding system for mechanically aligned SOI and direct wafer bonding with LowTemp™ plasma activation, all essential steps for fusion bonding from cleaning, plasma activation and alignment to pre-bonding and IR-inspection are combined. Thus, the field-proven, industry-standard EVG850LT assures a high-throughput, high-yield production process for void-free SOI wafers up to 300 mm sizes..

Features

  • SOI and direct wafer bonding with EVG's LowTemp™ plasma activation
  • Suitable for a wide range of fusion/molecular wafer bonding applications
  • Production system built to operate in high-throughput, high-yield environments
  • Automated cassette-to-cassette operation (ergo load, SMIF or FOUP)
  • Contamination-free backside handling
  • Megasonic and/or brush cleaning
  • Pre-bonding with mechanical flat or notch alignment
  • Advanced remote diagnostics