The SmartView NT automated bond alignment system for universal alignment offers a proprietary method for micron-level face-to-face wafer-level alignment. This alignment technique is key to achieving the required accuracy in multiple wafer stacks for leading-edge technologies. SmartView technology can be combined with the GEMINI wafer bonding systems for subsequent permanent bonding in a fully automated platform.
|Substrate / Wafer parameters|
|Size: 150 - 200, 200 - 300 mm|
|Thickness: 0,1 - 5 mm|
|Max. stack height: 10 mm|
|3 cassette stations (up to 200 mm) or 2 FOUP load ports (300 mm)|