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Related Products
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EVG®150 Automated Resist Processing System
Designed to provide the widest range of process variations, the EVG150 series' modularity accepts spin and spray coating, developing, bake and chill modules to suit your individual production requirements.
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EVG®6200∞ Automated Mask Alignment System
With full field proximity exposure of very thick resist layers, the EVG6200 Infinity Automated Mask Alignment System targets wafer bumping and chip scale packaging markets as well as applications in MEMS, Compound Semiconductor, Power Devices and Nanotechnology.
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HERCULES® Lithography Track System
The HERCULES® is a fully-integrated lithography track solution for wafers and substrates up to 300 mm, featuring EVG’s established optical mask alignment technology with integrated cleaning, resist coating, baking and resist development modules.
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Bonding
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EVG®510 Semi-automated Wafer Bonding System
The EVG510 Semi-automated Wafer Bonding System is configurable for all wafer bonding processes such as anodic, thermo compression, fusion bonding, or LowTemp™ plasma bonding.
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EVG®540 Automated Wafer Bonding System
The EVG540 is an automated single-chamber production bonder designed for pilot line and manufacturing as well as R&D for high volume manufacturing in Wafer Level Packaging, 3D-Interconnect and MEMS applications.
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EVG®620 Automated Bond Alignment System
Known for its high level of automation and reliability, the EVG620 Automated Bond Alignment System is designed for wafer-to-wafer alignment up to 150 mm wafer sizes.
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EVG®820 Lamination System
The EVG820 lamination station is used for automated, stress-free lamination of any kind of dry adhesive film onto the carrier wafer.
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