Advanced Packaging, 3D Interconnect

Darunter werden fortschrittliche Techniken der Kontaktierung, des Verbindens und Testens von fertigen ICs auf Waferebene zusammengefasst.


 
SCTaiwan_RGB_msSEMICON Taiwan 2018
September 05 - 07, 2018, Taipei Nangang Exhibition Center 1F & 4F, Taipei, Taiwan
Visit us at our booth #L212 at SEMICON Taiwan 2018.

logo_estc_headESTC 2018
September 18 - 21, 2018, Westin Bellevue, Dresden, Germany
Visit our talk "Laser Debonding Enabling Ultra-Thin Fan-Out WLP Devices" presented by Dr. Thomas Uhrmann at ESTC 2018.

IWLPC-2017-LogoIWLPC 2018
October 23 - 25, 2018, DoubleTree by Hilton San Jose, CA, USA
Visit us at our booth #36 at IWLPC 2018.

semiconeuropa_logoSEMICON Europa 2018
November 13 - 16, 2018, Messe Munich, Munich, Germany
Visit EVG at booth #A-4241 at SEMICON Europa 2018.