Advanced Packaging, 3D Interconnect

Darunter werden fortschrittliche Techniken der Kontaktierung, des Verbindens und Testens von fertigen ICs auf Waferebene zusammengefasst.


 
ECTC2017ECTC 2017
May 30 - June 02, 2017, Walt Disney World Swan and Dolphin Resort, Lake Buena Vista, FL
Visit our booth #405 at ECTC 2017.

semiconwestSEMICON West 2017
July 11 - 13, 2017, Moscone Center, San Francisco, CA
Visit our booth #7211 at SEMICON West 2017.

cropped-logoiceptICEPT 2017
August 16 - 19, 2017, Harbin, China
Meet us at ICEPT 2017.

empcEMPC 2017
September 10 - 13, 2017, Warsaw University of Technology, Poland

semiconeuropa_logoSEMICON Europa 2017
November 14 - 17, 2017, Messe München, Munich, Germany
Visit us at our booth #B1-1424 at SEMICON Europa 2017.