Advanced Packaging, 3D Interconnect

Darunter werden fortschrittliche Techniken der Kontaktierung, des Verbindens und Testens von fertigen ICs auf Waferebene zusammengefasst.


 
3D_Header_Website_1920x300_170713SEMI European 3D Summit 2018
January 22 - 24, 2017, Dresden, Germany

sckorea_0SEMICON Korea 2018
January 31 - February 02, 2018, COEX, Seoul
Visit us at our booth #C540 at SEMICON Korea 2018.

semiconchinaSEMICON China 2018
March 14 - 16, 2018, Shanghai New International Expo Centre, China
Visit us at our booth #3671 in hall N3 at SEMICON China 2018.

SSI_2018_LOGOKOMBI_OT_RGBsmartsystemsintegration 2018
April 11 - 12, 2018, Dresden, Germany
Visit us at our booth #07 at smartsystemsintegration 2018.

SPIE-Photonics-Europe-logoSPIE Photonics Europe 2018
April 22 - 26, 2018, Strasbourg Convention & Exhibition Centre, Strasbourg, France
Visit us at our booth #B311 at SPIE Photonics Europe 2018.