Advanced Packaging, 3D Interconnect

Darunter werden fortschrittliche Techniken der Kontaktierung, des Verbindens und Testens von fertigen ICs auf Waferebene zusammengefasst.


 
IWLPC-2017-LogoIWLPC 2018
October 23 - 25, 2018, DoubleTree by Hilton San Jose, CA, USA
Visit us at our booth #36 at IWLPC 2018.

semiconeuropa_logoSEMICON Europa 2018
November 13 - 16, 2018, Messe Munich, Munich, Germany
Visit EVG at booth #A-4241 and the presentation on November 13, about "Collective Die Bonding Technologies for Heterogeneous Integration in Advanced Packaging" at SEMICON Europa 2018.

IEEE IEDMIEEE IEDM 2018
December 01 - 05, 2018, Hilton San Francisco Union Square, CA, USA
Visit our booth at IEEE IEDM 2018.

EPTC2017EPTC 2018
December 04 - 07, 2018, Resorts World Singapore, Singapore
Visit us at our booth at EPTC 2018.

SCJapan_RGB_msSEMICON Japan 2018
December 12 - 14, 2018, Tokyo Big Sight, Tokyo, Japan
Visit us at our booth #5238 at SEMICON Japan 2018.