Archiv 2010
CARLSBAD, Calif., Dec. 8, 2010 - Shrink Nanotechnology announced today that it has entered into a multi-year development and manufacturing agreement with EV Group, a leader in the nano-imprint lithography process development and equipment manufacturing. The mutually exclusive, two year agreement calls for EV Group and Shrink to develop and manufacture Shrink’s structured substrates for its StemDisc stem cell and cell culturing platform.
mehr... SEMICON JAPAN, Chiba, Japan, December 1, 2010 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has developed a new micro-lens molding process that can enable volume production of very-high-resolution (up to eight megapixels and higher) wafer-level optics for use in smart phones, pico projectors and myriad other applications.
mehr... ST. FLORIAN, Austria, November 2, 2010 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that the company witnessed a more than 20-percent increase in overall revenue during fiscal 2010, ended September 30.
mehr... SEMICON EUROPA, Dresden, Germany, October 19, 2010 - EV Group (EVG) today announced receipt of its first order from the Fraunhofer Research Institution for Electronic Nano Systems ENAS (Chemnitz, Germany). Fraunhofer ENAS purchased an EVG6200NT automated mask aligner and an EVG540 automated wafer bonder, and will employ the flexible, multi-process EVG systems for mask lithography, ultraviolet nanoimprint lithography (UV-NIL), bond alignment, bonding and hot embossing (HE).
mehr... SEMICON EUROPA, Dresden, Germany, October 19, 2010 - EV Group (EVG) today announced the latest addition to its industry-leading EVG500 Series of permanent wafer bonding systems. The new three-chamber EVG520L3 wafer bonding system builds on the series' proven strengths in temperature control, piston force uniformity and modularity, with the next major implementation of the bond chamber concept-addressing the need for high-vacuum, CMOS-compatible bonding processes while delivering significantly higher throughput, cost of ownership (CoO) and yields.
mehr... SEMICON EUROPA, Dresden, Germany, October 18, 2010 - EV Group (EVG) today announced it has received an order for its GEMINI® fully automated wafer bonding system from Sensonor Technologies AS-a pioneer in the manufacture of MEMS sensors.
mehr... NNT CONFERENCE, Copenhagen, Denmark, October 13, 2010 - EV Group (EVG) today unveiled a new technology capability that enables ultra-high resolution patterning of features down to 12.5 nm: Soft Molecular Scale Nanoimprint Lithography (SMS-NIL). Based on EVG's proven UV-NIL systems, SMS-NIL provides customers with a repeatable, cost-effective process for producing ultra-high-resolution patterning on large-area surfaces.
mehr... TOKYO, JAPAN, September 29, 2010 – EV Group (EVG) today announced it has received an order from the University of Tokyo for its EVG301 megasonic wafer cleaning system for compound semiconductor research. Installed at the university’s Takagi & Takenaka Laboratory, the new tool is focused on preparing a particle-free wafer surface for bonding III-V materials to silicon wafers.
mehr... ST. FLORIAN, Austria, September 23, 2010 – EV Group (EVG) today announced it has shipped an EVG520IS semi-automated wafer bonding system and two EVG6200 automated alignment systems to King Abdullah University of Science and Technology (KAUST) in Saudi Arabia. Students at the graduate-level institution will use the EVG equipment for advanced technology research and development, including projects outsourced to KAUST from technology firms in the region.
mehr... ST. FLORIAN, 14. SEPTEMBER 2010 – Die EV Group (EVG), Technologie- und Marktführer beim Bau von Präzisionsanlagen zur Waferbearbeitung, konnte kürzlich die Zertifizierung nach ISO14001 erreichen. Das Unternehmen mit Hauptsitz in St. Florian am Inn kann damit ein funktionierendes Umweltmanagementsystem, mit dem die Weiterentwicklung von Umweltaktivitäten gesteuert werden soll, vorweisen.
mehr... SEMICON WEST, San Francisco, July 13, 2010 – EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it has received an order for its EVG520IS semi-automated wafer bonding system and EVG620TB mask and bond aligner from the University of Texas at Arlington (UTA).
mehr... ST. FLORIAN, Austria, July 12, 2010 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has introduced the EVG560HBL wafer bonder-the industry's first fully automated wafer bonding system for high-brightness light emitting diode (HB-LED) manufacturing.
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St. Florian, AUSTRIA and SINGAPORE, July 8, 2010–
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, and the Institute of Microelectronics (IME), a research institute of the Agency for Science, Technology and Research (A*STAR), today announced that they have entered into a two-year cooperation agreement to advance 3D IC integration technologies.mehr... ST. FLORIAN, AUSTRIA, July 6, 2010 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has introduced the EVG610 mask and bond aligner, specifically to address its university and research customers' demands for a lower costing system with greater process versatility.
mehr... ST. FLORIAN, Austria, May 31, 2010 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that world-renowned research institute, Fraunhofer IZM-ASSID, has placed an order for two EVG temporary bonding and debonding (TB/DB) systems for thin-wafer handling and processing for 3D ICs.
mehr... ST. FLORIAN, AUSTRIA, March 30, 2010 - EV Group (EVG) today announced that Morocco-based wafer-level camera manufacturer Nemotek Technologie has placed a repeat order for EVG’s bonding and UV nanoimprint lithography (UV-NIL) systems – the EVG520IS and IQ Aligner.
mehr... ST. FLORIAN, AUSTRIA, March 2, 2010 - EV Group (EVG) today announced that it has shipped two wafer bonding systems to the University of Michigan's Lurie Nanofabrication Facility (LNF) - a leading center for MEMS and microsystems research and an integral member of the National Nanotechnology Infrastructure Network (NNIN), which is supported by the National Science Foundation.
mehr... NANO TECH 2010-TOKYO, JAPAN, February 9, 2010 - NILCom, a nanoimprint lithography consortium comprising companies and research organizations throughout the imprint lithography supply chain, will be exhibiting at nano tech 2010 held February 17-19 in Tokyo, Japan.
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