Pressemitteilungen

EV Group Partners with NSI to Enable First Wafer-Level Heterogeneous Integration of GaAs on Silicon for RF Front-End Module Manufacturing  

2019_03_NSI_thumbnailSEMICON CHINA, March 20, 2019-EV Group (EVG) today announced that it has partnered with Ningbo Semiconductor International Corporation (NSI), a specialty semiconductor foundry based in Ningbo, China, in the development of the industry's first process technology platform for wafer-level heterogeneous integration of gallium arsenide (GaAs) on silicon for use in RF front-end module (FEM) manufacturing. This marks an important milestone in the development of next-generation, high-performance, ultra-compact RF front-end chipsets that are needed for 4G and 5G smartphones and other handsets.

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EV GROUP AND PANASONIC TEAM UP ON RESIST PROCESSING SOLUTION FOR PLASMA DICING  

2019_03_Panasonic_figure1_thumbnailSt. Florian, Austria / Osaka, Japan, March 13, 2019 -- EV Group (EVG) and Panasonic Smart Factory Solutions Co., Ltd. announced today that both companies have teamed up to provide a novel resist processing solution for plasma dicing that is developed for emerging applications, such as Internet of Things (IoT) sensors, MEMS, RFID, CMOS image sensors and thinned memories. This advanced solution, which incorporates the EVG®100 series of resist processing systems and Panasonic's APX300 Dicer Module plasma dicer, became available from March 13, 2019.

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EU project CALADAN set to reduce manufacturing cost of Terabit/s capable optical transceivers  

2019_03_Caladan_thumbnailEU project CALADAN set to reduce manufacturing cost of Terabit/s capable optical transceivers. CALADAN is an EU H2020 project, coordinated by IDLab, an imec research group at the Ghent University, which will establish a supply chain for fabrication of optical transceivers at significantly lower cost and higher throughput than what is achievable using current fabrication methods.

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