EV Group and IBM Sign License Agreement on Laser Debonding Technology  

2017_07_LaserDebonding_2_ThumbnailST. FLORIAN, Austria, March 14, 2018 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, and IBM (NYSE: IBM) today announced that the companies agreed to sign a license agreement on laser debonding technology. EVG plans to integrate IBM's patented Hybrid Laser Release process into EVG's advanced, field-proven temporary bonding and debonding equipment solutions, which can provide high-volume manufacturers with greater flexibility to implement optimized temporary bonding and debonding process flows.