SEMICON Japan 2017 Virtual Booth

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Join EVG at SEMICON Japan 2017 in Tokyo, Japan 

This year's exhibition theme is "Cutting-edge solutions for IoT", and EVG will present a wide range of solutions, such as high-precision bonding technologies which enable future 3D-IC devices, heterogeneous integration as well as manufacturing solutions for advanced wafer level packaging. Please visit us at our booth #5238.

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Exhibitor Seminar:
Latest Wafer Bonding Technologies - A Game Changer for IoT and AI

14-Dec. 2017 16:00-16:50
East Hall 4, TOKYO BIG SIGHT
Presenter: Hiroshi Yamamoto


Read our latest news:

EV Group Installs Low-Temperature Plasma Activation System for Compound Semiconductor Research at the University of Tokyo

 

2017_12_UniTokyo_thumbnailST. FLORIAN, Austria, December 12, 2017-EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it has received an order from the University of Tokyo for its EVG810LT plasma activation system for compound semiconductor research. Installed at the university's Takagi & Takenaka Laboratory, the EVG810LT augments the laboratory's research focused on developing novel MOSFET and electronic-photonic integrated circuits (EPICs) using III-V-on-insulator (III-V-OI) and germanium-on-insulator (GeOI) substrates.

Read more:
Press Release in English


Leti Demonstrates World's First 300-mm Wafer-to-Wafer Direct Hybrid Bonding With 1-Micron Pitch On EV Group System

2017_11_Leti_Pitch_previewST. FLORIAN, Austria and GRENOBLE, France, November 13, 2017 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, and Leti, an institute of CEA Tech, today announced the world's first successful 300-mm wafer-to-wafer direct hybrid bonding with pitch dimension connections as small as 1µm (micron). This breakthrough also achieved copper pads as small as 500nm.

Read more:
Press Release in English