SEMICON Taiwan 2014 Virtual Booth



Join EVG at SEMICON Taiwan 2014 

Visit our booth #316 to discuss your semiconductor, MEMS and Nanotechnology manufacturing needs and learn about our latest product news



Read our latest news:


EV Group Clears Key Barriers to 3D-IC/TSV High-Volume Manufacturing with Breakthrough Fusion Wafer Bonding Solution

  GeminiFB_EFEMEV Group (EVG) unveils the GEMINI®FB XT-its next-generation fusion wafer bonding platform, which combines several performance breakthroughs to move the semiconductor industry closer to the goal of high-volume manufacturing (HVM) of 3D-ICs with through-silicon vias (TSVs).

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Press Release in English
Press Release in Simplified Chinese
Press Release in Traditional Chinese

EV Group Boosts 2.5D and 3D-IC/TSV Performance with New NanoSpray™ Application on EVG150XT High-Volume-Manufacturing Photoresist Processing System

  2014_02_EVG150NXT-Automated-NanoSpray-Coating-SystemEV Group (EVG) announced that its patented NanoSpray conformal coating technology is now available on its newly introduced EVG150XT resist coating and developing system for high-volume manufacturing (HVM) semiconductor applications. NanoSpray provides conformal coating of structures that have vertical sidewall angles-such as through-silicon vias (TSVs), through-glass vias and through-substrate vias used for 2.5D interposers and 3D-ICs-with thick polymer liners and photoresists. This unique capability, which is already available on previous-generation EVG resist processing platforms, has been used in production to reduce mechanical stress and improve electrical performance of these advanced-packaging interconnect structures.

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EVG presentations at SEMICON Taiwan 2014:

MEMS Forum
EVG Presentation: "State of the Art Wafer Bonding for 3D Integration of MEMS & CMOS for Smart Sensors"
Thursday, September 4th, 2014 | 11:05 - 11:30 | Room 401

SiP Global Summit 2014 - 3D IC Technology Forum
EVG Presentation: "Hybrid Wafer Level Bonding for 2.5D Interposer and 3DIC Manufacturing (An Equipment Perspective)"
Thursday, September 4th, 2014 | 14:35 - 15:00 | Room 504, 5F

EVG Presentation: "High Volume Wafer Level Mask Aligner and Resist Processing Solutions"
Friday, September 5th, 2014 | 11:00 - 11:30