Veranstaltungen

Slider_YoleNCAP2017_2000x525a2017 NCAP & Yole Développement Symposium on Advanced Packaging & System Integration Technology
April 20 - 21, 2017, Wuxi, China
Visit our presentation about "Temporary Bonding for FOWLP and Advanced Packaging" at the 2017 NCAP & Yole Développement Symposium on Advanced Packaging & System Integration Technology.

header-mefMEMS Engineer Forum 2017
April 26 - 27, 2017, KFC Hall Ryogoku, Tokyo, Japan
Visit us at our booth at the MEMS Engineer Forum 2017.

nil_id_program_2017NIL Industrial Day 2017
May 02 - 03, 2017, Berlin, Germany
Visit our booth and our presentation at the NIL Industrial Day 2017.

theconfab-logo976x477ConFab 2017
May 14 - 17, 2017, Hotel del Coronado, San Diego, CA
Visit EVG at The ConFab 2017.

Logo-cswCompound Semiconductor Week 2017
May 14 - 18, 2017, Berlin, Germany
Visit our poster presentation "Bonding Technology for Covalent, Oxide-free and Conductive Bonds for Compound Semiconductors" at the Compound Semiconductor Week 2017.

ECTC2017ECTC 2017
May 30 - June 02, 2017, Walt Disney World Swan and Dolphin Resort, Lake Buena Vista, FL
Visit our booth #405 at ECTC 2017.

transducers2017_bannerTransducers 2017
June 18 - 22, 2017, Kaohsiung, Taiwan
Visit us at Transducers 2017.

semiconwestSEMICON West 2017
July 11 - 13, 2017, Moscone Center, San Francisco, CA
Visit our booth at SEMICON West 2017.

cropped-logoiceptICEPT 2017
August 16 - 19, 2017, Harbin, China
Meet us at ICEPT 2017.

empcEMPC 2017
September 10 - 13, 2017, Warsaw University of Technology, Poland

MNE_2017MNE 2017
September 18 - 22, 2017, Braga, Portugal
Visit our booth at MNE 2017.

semimems-copySEMI European MEMS & Sensors Summit 2017
September 20 - 22, 2017, Grenoble, France

LOAC,M&MWC2017Lab-on-a-Chip & Microfluidics World Congress 2017
October 02 - 04, 2017, Coronado Island, San Diego, CA

semiconeuropa_logoSEMICON Europa 2017
November 14 - 17, 2017, Messe München, Munich, Germany
Visit us at our booth #B1-1424 at SEMICON Europa 2017.