EVG's wafer bonding solutions for heterogeneous integration and wafer-level packaging will be highlighted in two co-authored technical papers and an interactive poster session. Visit us at our booth #409 and check here or in the technical program!
Seminar Theme: To New Dimensions
Registration: 12:30 | Seminar: 13:00 - 18:15
Reception: 18:15 - 20:15
Monday, June 03, 2019: Dinner
Tuesday, June 04, 2019: Technology Day
Free registration will we available soon.
Visit us at our booth #27 at Transducers - Eurosensors 2019!
Visit our booth at MicroNano System Korea 2019!
in conjunction with ANFF-SA Microengineering Winter School
Monday, July 08, 2019 | 14:00 - 17:00 hrs followed by a networking reception
Registration is available now!
Visit EVG at booth #439 in the South Hall of the Moscone Center!
Visit our booth at SEMICON Taiwan!
Visit EVG at booth #21!
Meet us at the SEMI European MEMS & Sensors Summit 2019!
Visit the EVG experts at the Lab-on-a-Chip World Congress 2019!
Visit our booth #36 at the International Wafer-Level Packaging Conference!
Visit us at booth #31 at MicroTAS 2019!
Visit EVG at booth #B1630 at SEMICON EUROPA 2019!
Visit us at our booth #7624 at SEMICON Japan 2019!