表面聲波元件
 相关的产品

键合机

   

EVG®501 Wafer Bonding System

The EVG501 is a highly flexible R&D system that can handle small substrate pieces up to 200 mm wafers.

   

EVG®510 Semi-automated Wafer Bonding System

The EVG510 is configurable for all wafer bonding processes such as anodic, thermo compression, fusion bonding, or LowTemp™ plasma bonding.

   

EVG®520IS Semi-automated Wafer Bonding System

The EVG520IS is configurable for all wafer bonding processes such as anodic, thermo compression, fusion bonding, or LowTemp™ plasma bonding.

   

EVG®540 Automated Wafer Bonding System

The EVG540 is an automated single-chamber production bonder designed for pilot line and manufacturing as well as R&D for high volume manufacturing in Wafer Level Packaging, 3D-Interconnect and MEMS applications.

   

EVG®560 Automated Wafer Bonding System

The EVG560 accepts up to four bond chambers with various bond chamber configuration options for all bonding processes and wafers up to 300 mm.

解决方案

新闻和大事记

EV Group Rolls Out Next-Generation EVG120 Automated Resist Processing System

EVG集团向中国领先的晶圆代工厂交付300MM晶圆键合系统用于3D IC及高级芯片封装批量生产

更多新闻 ..

ECTC 2013

sensors expo & conference 2013

更多大事记 ..

TBDB_AD_Feb_13
更多

相关的产品

化合物半导体和 硅基功率器件

微电子机械系统

Product Range

EV Group Corporate Video

3D InCites reports on EVG Headquarters expansion and technology developments

参考文献


Semiconductor 3-D Equipment and Materials Consortium
EVG is member of the EMC-3D consortium, created for the development of cost-effective 3D TSV (Through-Silicon-Via) interconnect