EVG®620NT Automated Mask Alignment System

Mask aligner designed for optical double-side lithography. Volume production types and manual R&D systems are available.

 

The EVG620NT Automated Mask Alignment System, which handles sizes of substrates starting from less than 5 mm up to 150 mm, offers new state-of-the-art features, including a granite base, active vibration isolation and linear motors to meet higher precision and throughput requirements.  Built upon EV Group's most flexible and versatile alignment system platforms, these new systems enable manufacturers to easily scale between R&D efforts to volume manufacturing in a simple one-to-one process transfer from manual mode to full automation.  The ramp-up ease to volume manufacturing coupled with alignment accuracies improvements-down to 0.1 µm with insitu alignment verification-deliver significant cost-of-ownership (CoO) benefits.

Features

  • High resolution top and bottom side splitfield microscopes
  • Handling of multiple wafer sizes with quick change-over time
  • High degree of automation (multiple send/receive cassettes)
  • Manual substrate loading capability on automated system
  • Windows® based user interface
  • Options
    - Cassette-to-cassette handling system
    - Automatic alignment
    - Insitu alignment verification
    - Field upgradeable from manual to fully-automated version
    - NanoAlign® package for enhanced process capabilities
    - Thin or warped wafer handling
    - Nanoimprint lithography and micro contact printing
    - Bond alignment
    - Active vibration isolation
    - Simulation software for mask aligner lithography process