EVG®6200∞ Automated Mask Alignment System

Optimized for highest throughput, highest mean time between failures and most accurate print gap settings.

 

The EVG6200∞ Alignment System is optimized for highest throughput, highest mean time between failures and most accurate print gap settings. It accommodates wafers and substrates up to 200 mm, varying in size, shape and thickness. Equipped with EV Group's new NanoAlign Technology, the EVG6200∞ Alignment System improves competitiveness of full-field lithography by providing the industry´s highest alignment accuracy and resolution at lowest cost of ownership. With full field proximity exposure of very thick resist layers, the EVG6200∞ targets wafer bumping and chip scale packaging markets as well as applications in MEMS, Compound Semiconductor, Power Devices and Nanotechnology.

Features

  • High resolution top and bottom side splitfield microscopes
  • Handling of multiple wafer sizes with quick change-over time
  • High degree of automation (multiple send/receive cassettes)
  • Manual substrate loading capability on automated system
  • Windows ® based user interface
  • Options
    - Cassette-to-cassette handling system
    - Automatic alignment
    - Field upgradeable from manual to fully-automated version
    - NanoAlign ® package for enhanced process capabilities
    - Thin or warped wafer handling
    - Nanoimprint lithography and micro contact printing
    - Bond alignment
    - Simulation software for mask aligner lithography process