EVG®150XT Automated Resist Processing System up to 300mm

Fully-automated coat/develop process and high-throughput performance.

 

  • Substrate/Wafer dimensions:  200 / 300 mm
  • Max. number of process modules: 9
  • FOUPs:  Max. 4 - Optional FOUP Storage System 
  • Processes: Spin Coat, Spray Coat, NanoCoat™, Develop, Bake/Chill/Vapor Prime, Inline Metrology
  • Filter Fan Unit: Optional

  • Spin Module:
    • 5000 rpm spin speed +/-1 rpm
    • Options:
      • Edge Bead Removal / Backside rinse
      • High accuracy Edge Bead Removal
      • Recipe programmable exhaust rates
      • Flow sensors on all solvent and developer lines
    • Dispense systems:
      • Low viscosity resist pumps
      • High viscosity resist pumps
      • Pulsation free spray pump
      • CPD systems
      • Dispense pumps

  • NanoCoat™ Module:
    • Dedicated Module to support NanoSpray™ and NanoFill™ proces

  • Developer Module:
    • Developer modes: Stream, Spray; Megasonic Area Transducer
    • Options:
      • Backside rinse
      • Recipe programmable exhaust rates
      • Flow sensors on all solvent and developer lines
    • Various dispense systems:
      • CPD systems
      • Dispense pumps

  • Bake/Chill Module:
    • Number of plates per module: Max. 4
    • Bake Plate:
      • Bake method:
        • Bottom and top side heating (optional)
        • Programmable proximity, fixed proximity pins (optional)
        • Optimised exhaust path for best uniformity of thick resist coatings
      • Temperature: Max. 250°C
      • Temperature uniformity: +/-0.45°C at 100°C
    • Chill Plate:
      • Chill method: Programmable proximity, fixed proximity pins (optional)
      • Temperature range: 15 - 30°C
      • Temperature uniformity: +/- 0.5°C
    • Vapor Prime:
      • HMDS Vapor Prime: HMDS bubbling
      • Temperature: Max. 150°C