EVG®150 Automated Resist Processing System up to 300mm

Fully-automated coat/develop process and high-throughput performance.

 

Designed as a fully modular platform, the EVG150 allows automated spray/spin/develop processess and high-thoroughput performance. The EVG150 produces highly uniform coats and improves repeatability to suit these needs. Wafers with high topography can be uniformly coated by EVG’s OmniSpray® technology, where traditional spin coating encounters limitations.

Features

  • OmniSpray® (x/y or rotational spray coating)
  • Spinner modules for coating (spin) or developing
  • Bake modules
  • Chill modules
  • Cost effective system for optimized production
  • Sophisticated field-proven wafer handling by robot
  • System customized for best benefit, including tooling (chucks), handling
    (robot endeffector, pre-aligner) and modules
  • Options
    - OmniSpray ® coating for optimized coating of high topography surfaces
    - Temperature controlled resist & developer lines
    - Bake modules for up to 350 °C
    - Vapor prime
    - Handling of thick, bowed or small diameter wafers
    - Handling of ultrathin and fragile substrates
    - SMIF Input output modules (for 150 + 200 mm)
    - FOUP load ports (for 200 + 300 mm)
    - Optional NanoCoat™ module supports NanoSpray ™ and NanoFill™ processes