EVG®770 Automated NIL Stepper
相关的市场
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先进封装，三维层叠互联
Wafer level packaging employs specific alignment and wafer bonding techniques as an enabling solution for stacking of wafers and three-dimensional integration of devices.
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纳米技术
Nanoimprint Lithography (NIL) is one of the most promising and cost-effective new techniques for generating nanometer-scale-resolution patterns for a variety of commercial applications in BioMEMS, microfluidics, optics, patterned media and electronics.
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