For hot embossing applications of polymer substrates and spin-on polymers with excellent pattern fidelity.
EVG and Dynaloy Jointly Develop Single-Wafer Cleaning Solution
Fraunhofer ISE Teams up with EVG to Enable Direct Semiconductor Wafer Bonds
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Photonics Festival 2013
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EV Group Breaks through Resolution Barrier with Introduction of Soft UV Nanoimprint Lithography Technology
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Consortium for Commercialization of Nano Imprint Lithography (NIL)