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EVG®520HE Semi-Automated Hot Embossing System

For hot embossing applications of polymer substrates and spin-on polymers with excellent pattern fidelity.

综述 Technical Data Gallery Downloads

Stamper/substrate size: up to 200 mm diagonal
Stack thickness: max. 15 mm
Contact force: 40 kN, 60 kN
Temperature up to 550°C
Temperature stability: ± 1 %
Temperature uniformity: ± 1.5 %
Vacuum capability: down to 10-5 mbar

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