Technical
Papers
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Fabrications
of micro-channel device by hot emboss and direct bonding of
PMMA
Abstract: We have fabricated and evaluated the mechanical,
optical and fluidic characteristics a 50um wide and a 30um deep
micro-channel device produced by hot emboss and direct bonding of PMMA
plate with dimensions of 20mm x 20mm x 1mm. The fabricated micro-channel
device was evaluated the bond strength, which was confirmed to be high
enough for practical use as well as for quite severe cleaning conditions as
ultrasonic cleaning in pure water...
Impact of
vacuum environment on the hot embossing process
Abstract: One of the key questions concerning the concept
of a system for hot embossing lithography is whether or not it should
provide for imprinting under vacuum. We have performed experiments
comparing the embossing in vacuum and in atmospheric pressure in a
semi-automated imprint system. The stamps used were fully patterned, 10cm
diameter with pattern sizes ranging from 400nm to 100µm...
Nanoimprint
lithography a next generation high volume lithography
technique
Abstract: Nanoimprint
Lithography has been demonstrated to be one of the most promising next
generation techniques for large-area structure replication in the
nanometer scale. This fast and low cost method becomes an increasingly
important instrument for fabrication of biochemistry, µ-fluidic, µ-TAS
and telecommunication devices, as well as for a wide variety of fields
in the nm range, like biomedical, nano-fluidics, nano-optical
applications, data storage, etc...
Nanoimprint
lithography - full wafer replication of nanometer
features
Abstract: Nanoimprint Lithography (NIL) is a fast, high
resolution replication technology for micromechanics, microbiology and even
for microelectronic applications in the sub-100nm range. The technique has
been demonstrated to be a very promising next generation technique for
large-area structure replication up to wafer-level in the micrometer and
nanometer scale...
Nanoimprint
lithography with a commercial 4”-bond system for hot
embossing
Abstract: In order to examine the suitability of
nanoimprinting for wafer scale pattern definition, a commercially available
hot embossing system, the EV520HE of EVGroup, Austria, has been used to
imprint 4 inch substrates. The EV520HE is based on a production-proven
wafer bonding system which guarantees compatibility with semiconductor
fabrication conditions...
Nanostructuring
of polymers by hot embossing lithography
Abstract: While researchers of ever more advanced NGL
systems are still struggling to demonstrate the feasibility to manufacture
features well below 100 nm at an affordable cost and a reasonable
throughput, nanoimprint technologies are emerging as a possible answer to
these challenges. 100 nm patterns are imprinted with a fully patterned 4
inch diameter stamp in a low-temperature embossing process...
One micron
precision optically aligned method for hot-embossing and
nanoimprinting
Abstract: This paper reports an optically aligned
hotembossing and imprinting method for biomedical, microfluidic, and
microoptical sensors. Hot-embossing technology is a low cost, flexible
fabrication method, which has demonstrated high aspect ratio polymer
microstructures as well as nanoimprinting patterns. It uses polymer
substrates to imprint a pattern created on a master stamp...